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Shenzhen Chenghe Electronic Industrial Co.,Ltd
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Showing 1 - 9 of 9, total 1 pages [First] [Previous] [Next] [Last]
1
pcb
Specification: 4-layer PCB
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...
2
pcb
Specification: 6-layer PCB
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...
3
pcb
Specification: 4-layer OSP PCB
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...
4
pcb
Specification: 4-layer Plating Gold PCB
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...
5
pcb
Specification: Mulit layer Plating Gold PCB
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...
6
pcb
Specification: Mulit layer HAL LF board
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...
7
pcb
Specification: 4-layer ENIG PCB board
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...
8
pcb
Specification: Double layer pcb board
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...
9
printed circuit board
Specification: Double layer pcb board
Detail: Our PCB Production Capability Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-10 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold ...
Showing 1 - 9 of 9, total 1 pages [First] [Previous] [Next] [Last]
1
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